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This resume has been forwarded to you at the request of Monster User xapeix01

Xu Wang 

Last updated:  10/29/12

Job Title:  no specified

Company:  no specified

Rating:  Not Rated

Screening score:  no specified

Status:  Resume Received


Frisco, TX  75035
US

Home: 972-540-9588   
xuwang71@yahoo.com
Contact Preference:  Email

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RESUME

  

Resume Headline: Sr. Hardware Engineer

Resume Value: dwry9fhaa39bx5ne   

  

 

              Resume – Xu Wang

Xu Wang

15725 Crown Cove Ln • Frisco, TX 75035

Cell Phone: (214) 274-8620 • E-mail: xuwang71@yahoo.com

 

Summary of qualifications

 

q       More than 15 years hardware design experience building telecommunications equipment

q       5+ years technical management experience, including technical leadership, project management, and team coaching

q       Startup experience, was one of the founding engineers at Santera Systems Inc., and was actively involved in the complete product life cycle – from product architecture definition, detailed hardware design and prototype testing, to production, support and maintenance.

q       Hands-on digital circuit design experience – High-speed digital board-level design, High-speed serial links, Signal integrity analysis, VHDL or Verilog based FPGA/CPLD design (Xilinx/Altera/Actel), Embedded system design with 32-bit microprocessors (PowerPC), Network Processors (Cavium, LSI/Agere), DDR3/DDR2 SDRAM interfaces, PCI Express and PCI bridges, Phase Locked Loop (PLL), Digital Signal Processors (TI TMS320 DSP).

q       Well versed in communications technologies – 10-Gigabit Ethernet (both fiber/copper interfaces and across backplane such as 10GBASE-KR), Ethernet switch fabric, SONET/SDH interfaces (including OC-3/OC-12 and STS-1, DS3, T1/E1), ATM switch fabric, TDM switching (Time Slot Interchange or TSI), Network timing synchronization, Wireless communications (Digital Filter/Modulation/Demodulation).

q       EDA Software – ModelSim, Synplify, Altera Quartus II, Xiline ISE, HyperLynx, PSPICE, OrCAD Capture CIS, Cadence Allegro, Mentor Board Architect, etc. Familiar with PCB layout process especially critical routing constraints.

q       Test Equipment – Oscilloscope, Logic Analyzer, Time Domain Reflectometry (TDR), Communications Analyzer, Jitter and Wander Analyzer, JTAG Debugger, etc.

Work experience

 

Futurewei Technologies, Inc. (Huawei US R&D Center)              Plano, TX

Sr. Hardware Systems Architect              December, 2011 – Present

q       Analyzed Microsoft SQL Server appliance hardware architectures, including Fast Track Data Warehouse (FTDW) and Parallel Data Warehouse (PDW). Jointly proposed the architectures and configurations of Huawei SQL Server FTDW and PDW, taking advantage of Huawei’s hardware strength. Studied SQL Server best practices and conducted initial FTDW benchmark testing based on Microsoft Reference Point software. Directed the follow-on FTDW testing in Shenzhen, China.

q       Studied and analyzed the open source framework Hadoop (HDFS and MapReduce) for Big Data analytics applications, with an emphasis on the hardware requirements and opportunities for hardware acceleration, especially in storage and networking.

 

GENBAND / Tekelec / Santera Systems Inc.              Plano, TX

Sr. Manager of Hardware Engineering              August, 2005 – November, 2011

q       Managed the hardware development of GENBAND G9/8000 media gateways, including hardware architecture, chassis, circuit boards, and firmware/driver. Responsible for resource planning, schedule creation and tracking, coordination of hardware and software integration, compliance testing such as NEBS-3, and team coaching. Significant amount of sustaining engineering / product support was also involved.

q       Technically guided the hardware development team in Plano, TX and the offshore development team in Shanghai, China. Coordinated the communications between the hardware team in Shanghai and the larger development community in Plano, TX.

q       Led the development of the enhanced airflow chassis for G9 media gateway, with updated fan trays and associated sheet metals, to fully support the 3rd generation DSP blades equipped with Mindspeed Comcerto 5000 SoC and the new 10GbE line cards. The enhanced 14RU chassis supports a system power consumption of over 3,000 Watts.

q       Defined the hardware architecture of the 3rd generation system controller and Ethernet fabric of G9 (PAC3). Selected Freescale 8-core QorIQ PowerPC and Fulcrum 72-port FocalPoint 10GbE switch with built-in 10GBASE-KR SerDes (which was later replaced by Broadcom StrataXGS Trident switch due to Fulcrum’s delayed release). Jointly defined hardware feature requirements and handed over the detailed hardware design and verification to the offshore team in Shanghai.

q       Hardware architect of the border gateway function (BGF) of G9. Primary hardware designer of the 10GbE (or 8-port GbE) line card of G9, which was the key circuit board for BGF. Key components include Cavium Networks Octeon II 16-core MIPS64 processor, Freescale dual-core QorIQ PowerPC, DDR3 VLP-RDIMM, Broadcom 24-port GbE Switch with 10GbE uplinks, Broadcom 10GBASE-T PHY, Applied Micro 10GBASE-LRM PHY, and Xilinx FPGA. Responsible for architecture definition, detailed design specification, schematic capture, Signal Integrity (SI) simulation, directing PCB layout, FPGA coding, and prototype verification.

q       Designed the 2-port GbE line card of G9 called GEI-2. Key components include LSI/Agere APP340 Network Processor with DDR2 memories, Applied Micro PowerPC 405GPr, Marvell 16-port GbE Switch, and Altera FPGA. The board was fully functional and released to production at Rev 1.

q       Designed the OC-3c/OC-12c ATM line card of G9, which supports two OC-12c or eight OC-3c ATM interfaces. The card has all the key components of the GEI-2 card, with the addition of ATM over SONET framer, SONET Clock and Data Recovery circuit (CDR), and SONET clock synthesizer.

q       Designed the universal E1/T1 TDM interface card of G9. It is a cost reduction design for the previous generation and also features programmable E1/T1 termination as well as enhanced channel associated signaling (CAS) capabilities.

q       Studied PICMG ATCA, AMC, and MicroTCA standards for future platforms and new cards on existing platforms.

 

Sr. Hardware Design Engineer              June, 1999 – July, 2005

q       Cost reduction design of the Packet Matrix mezzanine card for the 20Gb/s ATM switch fabric of SanteraOne media gateway (GENBAND/Tekelec 8000).  The primary change was to reduce the number of FPGAs and migrate Xilinx Virtex-E FPGAs to less expensive Spartan-IIE family. Utilized Xilinx ISE Floorplanner to manually place timing critical logic inside certain Spartan-IIE FPGAs to achieve the same performance as Virtex-E. PCB placement was also fine tuned to improve timing margin.

q       Sustained the SanteraOne Packet Matrix base board with 10Gb/s switching capacity. The ATM switch fabric is based on MMC Networks' AF5500 chipset with a shared memory virtue output queuing architecture. Maintained multiple FPGA designs, including backplane interface logic for cell header and payload multiplexing, message buffer and common memory address generation logic, and sub-port scheduler for the Per Flow Scheduler device.

q       Designed the DS3/OC-3c/OC-12c ATM line card of SanteraOne. It is consisted of ATM over SONET (or DS3) framers, and ATM switch fabric interface devices (PIF2) from MMC Networks.

q       Designed the OC-3/DS3 TDM interface card of SanteraOne. Agere SuperMapper was selected as the OC-3/DS3/DS1/E1 framer/multiplexer. Designed FPGAs for TDM highway multiplexing, RBS/CAS extraction, FDL processing, and proprietary backplane CPU bus interface. Lead designer of the backplane redundancy bus of a 1:N equipment protection scheme for the DS3 interfaces. Key contributor to the DS3 1:N redundancy cable assembly design.

q       Designed the E1/T1 TDM interface card of SanteraOne with Infineon QuadFALC.  Co-inventor of a patented 1:N equipment protection method that enables in-service replacement of failed cards, which is consisted of a backplane redundancy bus and a E1/T1 redundancy cable assembly.

 

SanCom Technology, Inc.              Austin, TX

Hardware Design Engineer              December, 1997 – May, 1999

q       Designed the OC-3c/OC-12c ATM line card of AS-850 ATM access concentrator. There is also a Bellcore GR-1244 compliant Stratum-3 network timing module on the card to provide timing to the AS-850 system.

q       Designed the T1/E1 TDM interface card of AS-850. Infineon QuadFALC was selected as the T1/E1 LIU/framer combo.

q       Designed the Network Clock Controller of CS-1000 ATM switch, which includes a Stratum-3 network timing module, BITS interface, and an HDLC controller for the SS-7 link.

 

Harris Communications (Shenzhen) Ltd.              Shenzhen, China

Hardware Design Engineer              November, 1996 – November, 1997

q       Designed the radio processor card of MicroStar Plus 7/8GHz digital microwave communication system (radio). It was the control card of the outdoor unit, with a Motorola MC68HC11 micro-controller.

q       Architected the order-wire service card of the Constellation radio.  The building blocks of the card are PCM CODECs, voice bridges, signaling unit, and PCM voice channel multiplexer.

 

Huawei Technologies Company, Ltd.              Shenzhen, China

Firmware Engineer              August, 1996 – October, 1996

q       Maintained the firmware of the MSU (Multiple Subscriber Unit) RF channel board in a wireless local loop (WLL) system. The micro-controller is NEC uPD78054, and the primary function of the software is to process the wireless channel associated signaling.

 

Tsinghua University              Beijing, China

Research Assistant              June, 1993 – June, 1996

q       Designed the multi-channel digital baseband receive shaping filter for a satellite on-board processing system. A TI TMS320C25 DSP was utilized to implement the four-channel receive matched filtering by means of time-division processing.  Also designed the multi-channel pi/4-DQPSK modulator on the same card. TI TMS320C25 was utilized to implement the four-channel poly-phase FIR interpolation filtering for the transmit pulse shaping.

q       Designed the digital baseband transmit shaping filter for the QPSK modem of a VSAT (Very Small Aperture Terminal) system. A ROM-based look-up table was utilized to implement the transmit pulse shaping.

 

Education

 

September, 1994 – July, 1996              Tsinghua University              Beijing, China

Master of Science in Electrical Engineering

September, 1989 – July, 1994              Tsinghua University              Beijing, China

Bachelor of Science in Electrical Engineering

References

Available upon request.

 

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Additional Info

BACK TO TOP

 

Current Career Level:

Experienced (Non-Manager)

Years of relevant work experience:

10+ to 15 Years

Date of Availability:

Negotiable

Work Status:

US - I am authorized to work in this country for any employer.

Active Security Clearance:

None

US Military Service:

Citizenship:

US citizen

 

 

Target Job:

Target Job Title:

Sr. Hardware Engineer

Desired Job Type:

Employee

Desired Status:

Full-Time

 

Target Company:

Company Size:

Occupation:

Engineering

·         Electrical/Electronics Engineering

 

Target Locations:

Selected Locations:

US-CA-Silicon Valley/San Jose
US-TX-Dallas

Relocate:

Yes

Willingness to travel:

Up to 25% travel